Introduction: The MCX603-V⢠heatsink is of equal size and pin design to the MCX462-Vâ¢, thus features identical performance and usage specifications as outlined below: Optimized performance characteristics at the lowest possible audible noise levels. Full compatibility with all Intel® Xeon retention systems, thanks to two different retention solutions: Plug-and-play installation with Intel's validated retention mechanisms for OEM processors (does not necessitate removal of the motherboard for installation). Optional screw/spring assembly retention system (requires removal of the motherboard for installation). Features highlights Hybrid copper base, thin aluminum pin heatsink: the massive 1/2" thick copper base provides superior heat capacity for unparalleled stability in extreme overclocking applications. The thin aluminum pins promote increased turbulence for more efficient heat dissipation compared to traditional fin extrusions. The MCX603-V⢠is designed to work with 80mm fans only. In effect, there is not enough space between processors in most dual Xeon⢠motherboards to accomodate two 92mm fans side by side. Exceptional quality and attention to details: the heatsink base is lapped to 0.0003" (3/10 of 1/1000"), and polished to near-mirror finish to promote optimum thermal conductivity. Specifications: CNC machined, C110 copper base, 3"W x 3.3"L x .500"H, flatness better than 0.0003", micro surface finish 8 or better. 374 Helicoid Pins made of High Thermal Conductivity Aluminum Alloy, press fitted in the base. Heatsink base dimensions 3"x3.3"x1.66" Heatsink top dimension 3 3/4" x 3 1/2" Weight: 22 oz (620g)