Spire RackSper III - 9R272B1H3
Spire is proud of the successful release of the RackSper III. This 1U All copper active cooler solution has been a proven success over the years.

Standardized to fit any mainboard by simply placing the RackSper III into the supporter bracket this coolers is a cost effective and easy to assemble solution for the socket 478 micro-processors from Intel.

Supplied with SP-420 Thermal Grease interface material and 2 metal installation clips the RackSper III is the best 1U Soc.478 solution on the market today!
Main Features:
* Pure copper heat-sink
* Low profile - 1U
* 70x15mm powerful DC Fan

Product Specification
Socket 478 Cooling kit
Dimensions Heat sink : 83×60×16 mm (l × w × h)
12VDC Fan : 60×60×10 mm

Bearing Ball bearing
Rated speed 4800 RPM +/-10%
Rated power 3.36 W
Noise level 29 dBA
Air flow 22.21 CFM at 4800 RPM +/-10%
Current 0.28 A
Life hours Ball: 50.000
Features All copper heatsink, low profile
Connector 3 pin, mainboard
Application No applications defined
Thermal resistance 0.43 °C/W
Thermal type Stars-420 white grease (Injection tube)

* Pure copper heat-sink

* Low profile - 1U

* 70x15mm powerful DC Fan

* Socket 478 Cooling kit

Supplied with SP-420 Thermal Grease interface material and 2 metal installation clips